Automotive 3G SMT with Migration Path to LTE
The new Cinterion AHS3 flagship HSPA+ module for automotive applications is optimized for high quality audio support and high bandwidth connectivity allowing speeds up to 14.4 Mbps for downlink and 5.7 Mbps for uplink. The solderable platform offers true global 3G coverage in two cost-optimized variants for improved Total Cost of Ownership: AHS3-US and AHS3-W.
Equipped with high performance GPS, the AHS3 platform is already prepared to meet the comprehensive requirements of the European eCall and ERA-GLONASS initiatives. It also features in-band modem functionality, voice prompts, high quality audio according to VDA 2a, jamming detection, antenna diagnosis as well as TCP/IP services.
Based on Qualcomm’s latest chipset, the module’s extreme ruggedness and ultra compact LGA footprint guarantee long product availability and a reliable migration path to Long Term Evolution (LTE), critical as 4G technology becomes imperative to support future data-intensive services in automotive entertainment systems.